王娟
,
李亚江
,
马海军
金属学报
采用扫描电镜(SEM)、能谱分析(EDS)、X射线衍射(XRD)和电子探针(EPMA)对Fe3Al/Q235扩散焊界面的析出相形貌进行观察和成分测定，研究微观析出相的形成以及工艺参数(T, t , p)的影响. 结果表明， Fe3Al/Q235扩散焊界面靠近Fe3Al一侧形成FeAl(Cr)析出相，是引起扩散焊接头脆性断裂的关键. 扩散焊温度T、保温时间t与析出相区宽度y符合抛物线规律: y2=3.5 (t-t0)exp[-5.6×104/(RT)]. 在降低加热温度和保温时间的条件下，增加焊接压力可促进Fe3Al/Q235界面原子的扩散，避免脆性析出相的形成，保证Fe3Al/Q235扩散焊接头的性能.
关键词:
Fe3Al合金
,
steel Q235
,
diffusion bonding
HUANC Yan CUI Jianzhong MA Longxiang Northeast University of Technology
,
Shenyang
金属学报(英文版)
According to probability theory and atomic activation on bonding interface of metals, a mathematical model was developed for the atomic interfacial reaction during diffusion bonding.The effect of parameters of bonding processing and material on the bonding strength was then gained.It was suggested that the activation centre of atomic interfacial reaction of bonding may be,in situ,the boundary dislocation and its elastic stress field. A substantial agreement about the quantitative prediction of the model was made with the results of diffusion bonding experiments for 7075Al alloy
关键词:
diffusion bonding
,
null
,
null
P. He
,
J. H. Zhang
,
J. C. Feng and Y. Y. Qian (National Key Laboratory of Advanced Welding Production Technology
,
HIT
,
Harbin 150001
,
China)
金属学报(英文版)
TiAl was diffusion bonded to Ti and TC4 alloy in vacuum furnace. Results showed,at the TiAl-Ti interface,the reaction layer of stratification Ti3Al was formed closest to TiAl base,and the a phase and the α + βphase arised closest to Ti base at 1173K and 1573K respectively. The phase structure of TiAl/ and the phase structure of TiAlwere observed be- tween AiAl and TC4 under respetive bonding temperature.The fiacture at tensile testing occurred in the bond - line, producing very flat fracture surfaces with some pull-out of the TiAl materials.The ultimate tensile strengths of the joint were approximate to γ-TiAl base marterial.
关键词:
diffusion bonding
,
null
,
null
HUANG Yan
,
MA Longxiang Northeast Universtity of Technology
,
Shenyang
,
China lecturer
,
Department of Metalforming
,
Northeast University of Technology
,
Shenyang 110006
,
China
金属学报(英文版)
Diffusion bonding of supcrplastic Al alloy LC4,with prior surface treatment of organic solution protecting coating after electroplishing and stainless steel wool brushing,was performed by Gleeble test machine under conditions ranged 490—530 ℃,1.0—3.0 MPa. 30—180 min and vacuum of 1.0×10~(-3) Pa.The joints were examined to have similar strength and microstructure to the base metal Discussion was made on the effect of superplastic treatment on bonding.The micromechanism for diffusion bonding of super- plastic metal was suggested as the migration of original bond interfaces caused by atomic diffusion and grain growth. Experimental results for the alloy as quench-aged state were presented to compare with the superplastic one.
关键词:
superplasticity
,
null
,
null
,
null
W.B. Han
,
K.F. Zhang
,
B. Wang
,
D.Z. Wu
金属学报(英文版)
The superplasticity and diffusion bonding of IN718 superalloy were studied in this article. The strain rate sensitivity index m was obtained at different temperatures and various initial strain rates using the tensile speed mutation method; m reached its maximum value 0.53 at an initial strain rate of 1×10-4s-1 at 1253K. The diffusion bonding parameters, including the bonding temperature T, pressure p, and time t, affected the mechanism of joints. When the bonded specimen with 25μm thick nickel foil interlayer was tensile at room temperature, the shear fracture of the joints with nickel foil interlayer took place at the IN718 part. Microstructure study was carried out with the bonded samples. The microstructure shows an excellent bonding at the interfaces. The optimum parameters for the diffusion bonding are: T = 1273-1323K, p = 20-30MPa, t = 45-60min.
关键词:
superplasticity
,
null
,
null
,
null
Seyyed Salman SEYYED AFGHAHI
,
Mojtaba JAFARIAN
,
Moslem PAIDAR
,
Morteza JAFARIAN
中国有色金属学报(英文版)
doi:10.1016/S1003-6326(16)64295-4
采用扩散连接方法在压力范围10~35 MPa、温度430~450°C、时间60 min，真空13.3 mPa条件下连接Al 7075和 Mg AZ31合金。采用扫描电子显微镜、X射线能谱和X射线衍射分析合金的显微组织演变、相分析和元素分布。结果表明：25 MPa 为最佳的压力条件，在此条件下接头发生最小的塑性变形；在界面过渡区可观察到含不同金属间化合物如Al12Mg17, Al3Mg2和α(Al)的固溶体反应层；随着温度的升高，反应层的厚度增大，更多的铝原子扩散进入镁合金，且界面朝着铝合金移动；在温度440°C、压力25 MPa下得到最大的结合强度38 MPa。断口形貌研究表明，脆性断裂来自于Al3Mg2相。
关键词:
Al7075合金
,
MgAZ31合金
,
扩散连接
,
金属间化合物
,
界面过渡区
,
显微组织
,
力学性能
杜双明
,
刘刚
,
王明静
稀有金属材料与工程
采用真空扩散焊工艺,在加热温度500℃、保温时间40 rin、压力2.5 MPa、真空度1.0×10-2 Pa下制备了变形镁合金AZ31B/Cu双金属复合材料,并对复合材料界面区的微观结构和力学性能进行分析,探讨了界面反应层的形成机理.结果表明:铜在镁合金一侧富集出现晶界渗透现象.镁合金/Cu界面的组织依次为:α-Mg和沿其晶界析出相Mg17(Cu,Al)12/α-Mg/(α-Mg+Mg2Cu)共晶/Cu2Mg金属间化合物/(α-Mg+Mg2Cu)共晶/Cu(Mg)固溶体.硬度在基体两侧到界面中心区域内呈台阶式增加,最高显微硬度达到3510 MPa.Cu2Mg两侧的共晶液相出现具有先后次序,晶界渗透区与Cu2Mg之间先形成Mg-Cu共晶液相,然后共晶液相中的Mg原子穿越Cu2Mg层扩散至Cu侧,在Cu2Mg与Cu(Mg)固溶体之间形成Mg-Cu共晶液相.复合材料的界面抗剪强度达到61 MPa,剪切断裂发生在界面扩散层内,断口由撕裂棱和撕裂棱两边的大小不一的解理台阶构成.
关键词:
AZ31B/Cu复合材料
,
扩散焊
,
界面
,
显微组织
叶林森
,
谌继明
,
谢东华
,
王锡胜
,
许泽金
,
陈伟
稀有金属材料与工程
在不同表面粗糙度的Be侧镀Ti/Cu中间层,采用热等静压技术将铍与CuCrZr合金进行扩散连接.通过AES、SEM(EDS)、室温剪切试验和XRD等分析其镀层形貌及成分、界面特性与相结构.结果表明:9 μm Ti、35 μm Cu镀层带征较为均匀,影响扩散连接强度的元素较少,采用双靶单侧镀复合膜的工艺有利于减少Ti镀层的氧化;界面剪切强度明显提高,最高可达243 MPa,Be表面粗糙度的不同对强度影响不明显;Be-Ti连接强度高,剪切断裂均发生在Cu镀层.
关键词:
表面粗糙度
,
Be
,
CuCrZr合金
,
镀层
,
热等静压
,
扩散连接
董凤
,
陈少平
,
胡利方
,
樊文浩
,
孟庆森
材料工程
doi:10.11868/j.issn.1001-4381.2015.02.006
采用电场激活扩散连接技术(FADB)实现了AZ31B/Cu的扩散连接.利用SEM、EDS和TEM分析了扩散溶解层的显微组织、相组成和界面元素分布.采用万能试验机对连接界面的抗剪切性能进行了测试.结果表明:AZ31B与Cu通过固相扩散形成了良好的冶金结合界面,扩散温度低于475℃时扩散溶解层由MgCu2、Mg2Cu和MgCuAl组成,此时接头的薄弱环节为Mg2Cu.扩散温度为500℃时扩散溶解层由Mg2Cu、(α-Mg+ Mg2Cu)共晶组织和MgCuAl组成,共晶组织的形成导致接头的抗剪强度进一步降低,并成为新的薄弱环节.当扩散温度为450℃,保温时间为30min时,界面的抗剪强度随保温时间的延长先增大后减小,最大可达40.23MPa.
关键词:
扩散连接
,
电场
,
扩散溶解
,
AZ31B/Cu
沈强
,
向会英
,
李美娟
,
罗国强
,
王仪宇
,
王传彬
,
张联盟
稀有金属材料与工程
在低温下,利用Ag箔作中间层对Ti-6A1-4V钛合金(TC4)和无氧铜(OFC)进行了扩散焊接.结果表明Ag箔中间层阻止了Ti-Cu金属间化合物的生成,改善了TC4/OFC焊接接头的界面组织结构和焊接强度.同时,Ag箔中间层的添加也降低了TC4/OFC接头的焊接温度.焊接界面从TC4侧到OFC侧依次是TC4基体,AgTi金属间化合物,Ag中间层,Ag-Cu固溶体和OFC基体.在工艺条件:T=700℃,P=10 MPa,t=60 min下,TC4/Ag/OFC焊接接头的抗拉强度为150 MPa,其值高于直接焊接时的抗拉强度.焊接接头断裂发生在Ag/OFC界面,并且呈韧性断裂.我们可以推测AgTi化合物的韧性性能优于Ag-Cu固溶体.
关键词:
扩散焊接
,
Ag中间层
,
显微组织
,
力学性能
,
TC4钛合金
,
无氧铜
